Silicon wafers are used for the manufacture of discrete semiconductor devices (diodes, transistors), ultra-large-scale integrated circuits (VLSI) with thousands of semiconductor and passive elements, and microelectromechanical systems (MEMS).
The size range includes wafers with a thickness of 380, 420, and 460 microns and a diameter of 100 mm.
Microwave technology
Optoelectronics and photonics
Semiconductor devices and sensors
Photo-receiving devices (PRDs, MPDRs)
Photovoltaic converters (solar panels)
| Diameter, mm | 100 |
| Thickness, µm | 380; 420; 460 |
| Deviation from nominal value, µm | ± 25 |
| Crystallographic orientation, ° | (100); (111) |
| Dopant | B or P |
| Type | Monocrystalline silicon wafers KDB or KEF |
| Flat orientation | SEMI EJ |
| Polishing | Double-sided |
| TTV minimum, µm | 2 |
| TTV minimum/standard, µm | до 5 |